In order to comply with the trend of environmental protection, the lead-free soldering process standards for circuit boards have undergone important updates. The new standard puts forward stricter requirements for lead-free solder composition, soldering temperature curve, solder joint reliability, etc., aiming to reduce the emission of harmful substances such as lead in electronic waste and reduce its impact on the environment. This will encourage electronic manufacturing enterprises to upgrade their production equipment and processes, promote the transformation of the entire circuit board industry towards green manufacturing, and enhance the international competitiveness of products in the global environmental protection wave.
