In the field of modern electronic manufacturing, PCB circuit boards are the core components of electronic devices, and their quality and performance are crucial. OSP process circuit boards, as a common PCB surface treatment technology, are playing an increasingly important role.
OSP is the abbreviation for Organic Solderability Preservatives, which is translated as organic solder mask or copper protectant in Chinese. Simply put, OSP process is to chemically grow a layer of organic film on a clean bare copper surface. This layer of film has characteristics such as oxidation resistance, heat shock resistance, and moisture resistance, which can be used to protect the copper surface from further rusting (oxidation or vulcanization, etc.) in normal environments. But in the subsequent high-temperature welding, this protective film must be easily removed by the flux, so that the exposed clean copper surface can be immediately combined with the molten solder to form a solid solder joint in a very short time.