Cutting and grinding → drilling positioning holes → inner layer graphics → inner layer etching → inspection → blackening → lamination → drilling → heavy copper thickening → outer layer graphics → tin plating, etching tin removal →
Secondary drilling → inspection → screen printing solder mask → gold-plated plug → hot air leveling → silk screen characters → shape processing → test → inspection.
5. Process flow of multilayer nickel-plated PCB
Cutting edge grinding → drilling positioning hole → inner layer pattern → inner layer etching → inspection → blackening → lamination → drilling → heavy copper thickening → outer layer pattern → gold plating, film removal and etching →
Secondary drilling → inspection → silk screen solder mask → silk screen characters → shape processing → test → inspection.
6. Process flow of multi-layer board immersed nickel gold pcb board
Cutting edge grinding → drilling positioning hole → inner layer pattern → inner layer etching → inspection → blackening → lamination → drilling → heavy copper thickening → outer layer pattern → tin plating, etching tin removal →
Secondary drilling→inspection→screen printing solder mask→chemical immersion nickel gold→screen printing characters→shape processing→test→inspection.