Recently, the research team has made significant progress in the development of new circuit board materials. Traditional circuit board materials suffer from severe signal attenuation when facing high-frequency signal transmission, which limits the performance improvement of electronic devices. The newly developed material adopts a special molecular structure, which can effectively reduce signal transmission loss and greatly improve the efficiency of high-frequency signal transmission. This breakthrough is expected to promote the development of 5G communication equipment, high-performance computers, and other fields, providing strong support for the miniaturization and high performance of related equipment, and helping the electronics industry reach new heights.
