The manufacturing process of circuit boards has undergone innovation. In the past, there were technical bottlenecks in the production of high-precision circuit boards, which made it difficult to meet the demands of high-end electronic products. Nowadays, by introducing advanced photolithography technology and nanoscale processing techniques, the precision of circuit board manufacturing has jumped from the micrometer level to the nanometer level, enabling denser circuit layouts and finer circuit structures. This leads to higher integration and stronger performance of electronic devices, which is of great significance for the development of cutting-edge technologies such as artificial intelligence and autonomous driving, and will accelerate technological breakthroughs and product iterations in these fields.
