Organic silica gel is a kind of adhesive with adhesion property. After curing, the adhesive has the properties of sealing and waterproof. Especially, it can play the insulating property in electric appliances. At present, many electrical components or circuit boards are used in bonding and fixation.
How about the performance of silicone bonding circuit board?
Good viscosity performance. After curing, it has elasticity, which can protect the electronic components from loss caused by external impact. Bonding is also relatively firm, in the minus 50 degrees to zero between 200 degrees will not appear degumming, cracking phenomenon.
What factors affect the bonding performance of silicone?
After curing, if the silicone receives external force or cracks appear in extrusion, there is no need to worry excessively at this time. It is usually constructed in a low temperature environment. After curing, the bonding strength is not as high as that under a constant temperature environment.
2. If the electrical circuit board that needs bonding is not guaranteed to be clean and dust-free, the bonding strength will also be affected, and even bonding failure will occur.
3. If there are mobile electrical components in the late curing stage of silicone, the bonding strength will also be affected. If there is a moving electrical component before the curing reaction occurs, the bonding strength will not be affected.
4, organic silicone adhesive performance is good, use the field is very wide also, a lot of household electrical appliances have used, to be safe and best brand cooperation, such as ke, Moore, focus on research of organic silicone, provide customized organic silicone application solutions, wide range of USES, can be applied to new energy, military, medical, aviation, shipbuilding, electronics, automobiles, instrument, power supply, high iron, and other areas of the industry. In this way, the performance can be guaranteed. After curing, it also meets the requirements of environmental protection and has no impact on human health.