With the rapid development of 5G technology, HDI circuit boards are moving towards technological upgrades and miniaturization design trends. At the level of technological upgrading, the industry adopts advanced manufacturing processes to achieve high-precision circuit layout, improve wiring density per unit area, and create conditions for higher integration. In terms of manufacturing technology, advanced laser drilling technology accurately drills small high-quality guide holes to ensure the reliability of electrical connections; The laminated manufacturing process increases the number of layers on the circuit board and reduces the overall size and thickness. In practical applications, HDI circuit boards provide efficient data transmission and processing capabilities for 5G base stations, saving space in devices such as smartphones, achieving lightweight design, and enhancing user experience.
