The research on circuit boards in the field of quantum computing has achieved phased results. Researchers have successfully developed a special circuit board structure suitable for quantum computing, which can effectively reduce interference between quantum bits, improve the stability of quantum information transmission and processing, and take an important step towards the commercial application of [...]
A new environmentally friendly circuit board material has been successfully developed, which is based on biodegradable plant-based materials and replaces traditional chemical materials that are difficult to degrade. While ensuring the electrical performance of the circuit board, it significantly reduces environmental pollution during production and waste disposal, meeting increasingly strict global environmental standards and injecting [...]
Scientists have made a key breakthrough in circuit board miniaturization technology, using extreme ultraviolet lithography technology and new etching processes to reduce the width and spacing of circuits on circuit boards to new levels, enabling higher integration of circuit boards at smaller sizes and laying the foundation for the development of miniaturized electronic products such [...]
Recently, 3D printed circuit board technology has seen significant development. Researchers have improved printing materials and processes, achieving high-precision printing of more complex circuit structures. This not only shortens the production cycle of circuit boards, but also reduces production costs, providing a more efficient solution for small batch and customized circuit board production, which may [...]
The research team has successfully developed an innovative heat dissipation technology for circuit boards. By adding special nanomaterials to the substrate material, the thermal conductivity efficiency of the circuit board has been greatly improved, effectively solving the performance degradation problem caused by overheating of the circuit board in electronic devices. It is expected to be [...]
Flexible circuit boards are widely used in wearable devices, foldable smartphones, and other fields, and their bending life is a key indicator for measuring product reliability. Recently, the industry has released a new method for testing the bending life of flexible circuit boards. This method simulates the bending action and frequency in real usage scenarios, [...]
In order to comply with the trend of environmental protection, the lead-free soldering process standards for circuit boards have undergone important updates. The new standard puts forward stricter requirements for lead-free solder composition, soldering temperature curve, solder joint reliability, etc., aiming to reduce the emission of harmful substances such as lead in electronic waste and [...]
New progress has been made in the application of 3D printing technology in the field of circuit board manufacturing. Through 3D printing, complex circuit board structures can be directly constructed in three-dimensional space, achieving fine circuit layout and multi-layer structure design that traditional manufacturing processes cannot achieve. This approach not only shortens the research and [...]
With the rapid development of industries such as 5G communication and new energy vehicles, the requirements for heat dissipation performance of circuit boards are becoming increasingly stringent. Recently, a research team has successfully developed a high thermal conductivity circuit board material. This material adopts a new composite structure, with thermal conductivity increased by more than [...]
Recently, a circuit board detection technology based on AI image recognition has attracted industry attention. Traditional circuit board inspection relies on manual visual inspection or basic automation equipment, which is inefficient and prone to missed detections. The new technology utilizes AI algorithms to analyze circuit board images, which can quickly identify various defects such as [...]