In advanced packaging and HDI board manufacturing, micro hole processing with blind hole diameter ≤ 75 μ m has become a bottleneck. The new laser drilling method completes the formation by high-precision copper breaking in a single pass, abandoning the traditional multi-step hole repair process, and combining with an automatic optical inspection system (AOI) to [...]
A new green electroplating technology for PCB manufacturing is being promoted, which uses a fluorine free system for copper layer deposition and combines lead-free solder spraying technology to significantly reduce heavy metal pollution and harmful gas emissions during the production process, in compliance with international environmental standards such as RoHS and REACH. This technology is [...]
With the increase in training and inference tasks for generative AI models, the global demand for high-performance computing hardware has surged. This has directly driven the widespread application of high-precision multi-layer printed circuit boards with more than 20 layers, especially in data center switches and GPU interconnect modules, where high-frequency and high-speed PCBs have become [...]
Is there an active air cooling structure for flexible circuit boards using heat dissipation technology Display application flexible circuit board for folding display [15] Environmental protection treatment of PCB wastewater containing heavy metals requires multi-stage treatment [11] Is high-end ceramic circuit board used in high-frequency and high-temperature environments? [16] AI Fusion DeepSeek Helps Intelligent Identification [...]
With the development of artificial intelligence, AI models such as DeepSeek have been deployed in Dongguan and applied to intelligent quality inspection in the manufacturing industry. They can accurately detect small defects on circuit boards through image recognition technology, improving detection efficiency and accuracy. This trend marks a shift from "manufacturing" to "smart manufacturing" of [...]
The wastewater generated during the production process of circuit boards contains copper ions, complex heavy metals, organic compounds, and acid-base pollutants, mainly from processes such as grinding, etching, and electroplating. The processing technology includes steps such as classified collection, network breaking, chemical precipitation, biodegradation, and membrane separation, with the goal of achieving water resource reuse [...]
An international patent application titled "Flexible Circuit Board, Thin Film Overcover Packaging Structure and Display Device" has been published. This technology aims to improve the bending adaptability and signal transmission stability of circuit boards, and is widely used in new electronic products such as foldable screens and curved displays. This type of circuit board supports [...]
A flexible circuit board for LED lights in new energy vehicles has obtained a new patent. The design involves setting a top cover and a base on the board body, and incorporating a heat dissipation fan to introduce and discharge external cold air through the surface of the circuit board, achieving active heat dissipation. This [...]
BOE A obtained the invention patent authorization for "A printed circuit board and its preparation method, display device" on October 14, 2025 (patent number CN202110201857.X). This technology reduces glue overflow, reduces the size of circuit boards, and improves the integration of display devices through the design of diversion grooves, without involving specific cooperative enterprises. ✅ [...]
In November 2025, the Ministry of Industry and Information Technology released the draft of the "Standard Conditions for the Printed Circuit Board Industry", which clearly stated that new printed circuit board projects will be strictly controlled. This move aims to promote the green transformation and capacity optimization of the industry, requiring existing enterprises to meet [...]