With the rapid development of industries such as 5G communication and new energy vehicles, the requirements for heat dissipation performance of circuit boards are becoming increasingly stringent. Recently, a research team has successfully developed a high thermal conductivity circuit board material. This material adopts a new composite structure, with thermal conductivity increased by more than 50% compared to traditional materials, effectively solving the heat dissipation problem of circuit boards during high-power operation, ensuring stable operation of electronic devices, and providing key technical support for the development of key fields such as 5G base stations and new energy vehicle battery management systems.
