Definition/Explanation HDI (High Density Interconnect) technology is a key process used in printed circuit boards (PCBs) to achieve higher wiring density and smaller size. It is widely used in high-end electronic products such as smartphones, AI servers, and wearable devices. Key facts and trends HDI boards significantly increase the number of connection points per unit [...]
Advanced Materials and Technology Applications: The PCB industry continues to develop in the application of advanced materials and technologies. Intelligent and automated production technology: Intelligent and automated production technology is one of the development trends in the circuit board industry. Development of green environmental protection technology: The development of green environmental protection technology is also [...]
Driven by demand for high-frequency high-speed circuit boards: The rapid development of technologies such as big data, AI high computing power servers, and cloud services has correspondingly driven attention to the high-frequency high-speed circuit board market. PCB copper foil is widely used downstream: PCB copper foil downstream mainly includes copper-clad laminates and printed circuit board [...]
Driven by demand for high-frequency high-speed circuit boards: The rapid development of technologies such as big data, AI high computing power servers, and cloud services has correspondingly driven attention to the high-frequency high-speed circuit board market. PCB copper foil is widely used downstream: PCB copper foil downstream mainly includes copper-clad laminates and printed circuit board [...]
The market attention of HVLP copper foil has increased: With the rapid development of technologies such as big data, AI high computing power servers, and cloud services, the attention to the high-frequency and high-speed circuit board market has been driven. HVLP copper foil is mainly used for high-frequency and high-speed circuit boards.
The AI industry is shifting towards customized chips, and OpenAI's self-developed chips will be mass-produced OpenAI and Broadcom collaborate to develop self-developed AI chips: customized solutions to meet computing power needs. Industry background and motivation for cooperation. In recent years, with the rapid development of artificial intelligence technology, the demand for computing power by major [...]
In the field of consumer electronics: In the field of smartphones, FPC can be applied to modules such as antennas, camera modules, screen connections, fingerprint recognition, battery connections, wireless charging, etc; In 2023, the shipment volume of foldable screen smartphones in China was about 7.007 million units, a year-on-year increase of 114.5%. Since the first [...]
Significant growth in historical scale: From 2018 to 2023, the market size of the flexible printed circuit board (FPC) industry increased from RMB 3.738 billion to RMB 51.982 billion, with a compound annual growth rate of 69.29%. Strong growth momentum in the future: It is expected that the market size of the FPC industry will [...]
High frequency and high-speed technology: With the widespread adoption of 5G communication technology and the advancement of 6G technology, higher requirements have been put forward for the high-frequency and high-speed performance of circuit boards. High density interconnect (HDI) technology: HDI boards have the characteristics of high line density, small aperture, and small wiring space, which [...]
The market segmentation is obvious: the top tier companies in the global circuit board market, such as Foxconn and BYD, occupy the mid to low end market with cost advantages, but have insufficient voice in the high-end field. Second tier companies such as Shennan Circuit and Xingsen Technology have entered the high-end market through HDI [...]