Innovative material applications in circuit board design include high dielectric constant materials, low dielectric loss materials, ferroelectric and piezoelectric materials, which can reduce parasitic capacitance, improve device switching speed and frequency response, reduce signal attenuation, improve device efficiency and signal-to-noise ratio, and achieve device tunability and multifunctionality. In addition, there are new metallization processes such as copper interconnect technology, low resistivity barrier materials, conformal deposition, and atomic layer deposition, which can meet the requirements of low loss and high current density for high-frequency devices, and improve the reliability and service life of the devices.
