Flexible circuit boards are widely used in wearable devices, foldable smartphones, and other fields, and their bending life is a key indicator for measuring product reliability. Recently, the industry has released a new method for testing the bending life of flexible circuit boards. This method simulates the bending action and frequency in real usage scenarios, combined with advanced non-destructive testing technology, which can more accurately evaluate the performance changes of flexible circuit boards after repeated bending, providing scientific basis for product design and quality control, and helping to improve the service life and stability of electronic products related to flexible circuit boards.
