New progress has been made in the application of 3D printing technology in the field of circuit board manufacturing. Through 3D printing, complex circuit board structures can be directly constructed in three-dimensional space, achieving fine circuit layout and multi-layer structure design that traditional manufacturing processes cannot achieve. This approach not only shortens the research and development cycle, but also reduces the production cost of customized circuit boards, meeting the personalized and small-scale production needs of aerospace, medical equipment, and other industries, and promoting the development of circuit board manufacturing towards greater flexibility and efficiency.
