High value one-stop service from layout to assembly–XJYPCB
XJYPCB is PCB&PCBA manufacturer which specialized in quick turn prototype and mass production .
Rigid pcb from 1 layer to 28 layers, FPCB from 1 layer to 4 layers, SMT&DIP Assembly.We trust the high quality , the competitive price and the excellent service will be sure to meet your demands.
HDI PCB
HDI PCB, The full name is High Density Interconnector Printed Circuit Board, which is an electronic component used to connect electronic components in small spaces. The main features of HDI PCB include smaller components and wiring, higher component density, more wiring layers, advanced electrical performance, lower weight and thickness, and improved reliability
Rigid Flex PCB
Rigid Flex PCB is a new electronic interconnect technology that integrates the characteristics of rigid printed circuit boards (PCBs) and flexible printed circuits (FPCs). It combines rigid substrates (such as FR4) with flexible substrates (such as PI polyimide) through compression and other processes, combining the structural support capability of rigid boards with the bending and folding characteristics of flexible boards
PCB
High frequency PCB (high-frequency printed circuit board) refers to printed circuit boards with operating frequencies above 1GHz, widely used in fields such as RF communication, high-speed data transmission, and communication equipment. Its design and material selection need to meet the special requirements of high-frequency signal transmission. The following is a detailed introduction based on search results
Ceramic PCB
Ceramic PCB: low thermal expansion coefficient: well matched with silicon chips, reducing solder joint cracking caused by thermal stress.
High insulation and voltage resistance: ensuring electrical safety in high-voltage environments.
Excellent high-frequency performance: low dielectric loss, more stable signal transmission.
High mechanical strength: resistant to vibration and corrosion, suitable for harsh environments.
5G is comming
Because the number and complexity of 5G Massive MiMO antennas are much higher than 4G active antenna systems. Therefore, higher requirements are put forward for reducing the size of the antenna board.
We have various high-frequency board substitutes. It can replace various types of Rogers materials.












